SMDLTLFP250T4
Hersteller: | Chip Quik, Inc. |
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Produktkategorie: | Solder |
Datenblatt: | SMDLTLFP250T4 |
Beschreibung: | SOLDER PASTE LOW TEMP T4 250G |
RoHS-Status: | RoHS-konform |
Attribut | Attributwert |
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Hersteller | Chip Quik, Inc. |
Produktkategorie | Solder |
Form | Jar, 8.8 oz (250g) |
Typ | Solder Paste |
Serie | - |
Prozess | Lead Free |
Durchmesser | - |
Flux-Typ | No-Clean |
Haltbarkeit | 6 Months, 2 Months |
Drahtmessgerät | - |
Zusammensetzung | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Teilstatus | Active |
Schmelzpunkt | 281°F (138°C) |
Versandinfo | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
Digi-Key-Speicher | Refrigerated |
Shelf Life Start | Date of Manufacture |
Lager-/Kältetemperatur | 37°F ~ 46°F (3°C ~ 8°C) |
Auf Lager 11 pcs
Refrence Preis ($) | 1 pcs | 100 pcs | 500 pcs |
---|---|---|---|
$83.95 | $82.27 | $80.63 |
Minimale: 1