PA0062-S
Hersteller: | Chip Quik, Inc. |
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Produktkategorie: | Solder Stencils, Templates |
Datenblatt: | PA0062-S |
Beschreibung: | QFN-16 STENCIL |
RoHS-Status: | RoHS-konform |
Attribut | Attributwert |
---|---|
Hersteller | Chip Quik, Inc. |
Produktkategorie | Solder Stencils, Templates |
Typ | QFN/LFCSP |
Pitch | 0.031" (0.80mm) |
Serie | Proto-Advantage PA |
Material | Stainless Steel |
Dicke | 0.0040" (0.102mm) |
Teilstatus | Active |
Innere Dimension | 0.197" L x 0.197" W (5.00mm x 5.00mm) |
Äußere Dimension | 1.300" L x 0.900" W (33.02mm x 22.86mm) |
Thermal Center Pad | - |
Anzahl der Positionen | 16 |
Auf Lager 54 pcs
Refrence Preis ($) | 1 pcs | 100 pcs | 500 pcs |
---|---|---|---|
$11.59 | $11.36 | $11.13 |
Minimale: 1