| Bild | Teilenummer | Hersteller | Beschreibung | Stückpreis | vorrat | |
|---|---|---|---|---|---|---|
|
659-65AB | Wakefield-Vette | HEATSINK EXTRUSION 37MM | $0.98 | 69 | |
|
|
581102B02100G | Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | $2.95 | 73 | |
|
|
537-95AB | Wakefield-Vette | HEATSINK DC DC 1/4 BRICK VERT | $2.87 | 69 | |
|
|
D10850-40T1E | Wakefield-Vette | HEATSINK 128PQFP COMPOSITE | $2.83 | 74 | |
|
|
630-35AB | Wakefield-Vette | HEATSINK FOR 35MM BGA | $0.96 | 72 | |
|
|
527-24AB-ME | Wakefield-Vette | HEATSINK DC/DC HALF BRICK VERT | $2.83 | 62 | |
|
|
625-35AB | Wakefield-Vette | HEATSINK FOR 25MM BGA | $0.96 | 88 | |
|
|
507002B05300G | Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | $2.8 | 90 | |
|
|
254-195ABPE | Wakefield-Vette | HEATSINK TO PKG FOLDED FIN | $0.92 | 60 | |
|
|
1963841-2 | TE Connectivity AMP Connectors | QSFP SINGLE PCI EXTRUSION HS 4 | $2.7 | 64 | |
|
|
642-25AB | Wakefield-Vette | HEATSINK FOR 35MM BGA | $0.92 | 78 | |
|
|
1963839-2 | TE Connectivity AMP Connectors | GANGED QSFP SAN EXTRUSION HS 6 | $2.7 | 51 | |
|
|
527-24AB-T725 | Wakefield-Vette | HEATSINK DC/DC HALF BRICK VERT | $2.68 | 63 | |
|
|
7121DG | Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | $0.91 | 68 | |
|
|
2-1542009-7 | TE Connectivity AMP Connectors | RETENTION MODULE W/HARDWARE | $2.66 | 64 | |
|
|
1963842-2 | TE Connectivity AMP Connectors | QSFP SINGLE SAN EXTRUSION HS 6 | $2.64 | 80 | |
|
|
335714B00000G | Aavid, Thermal Division of Boyd Corporation | HEAT SINK | $0.91 | 99 | |
|
|
322805B00000G | Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | $2.56 | 99 | |
|
|
335814B00000G | Aavid, Thermal Division of Boyd Corporation | HEAT SINK | $0.9 | 58 | |
|
|
908-35-2-18-2-B-0 | Wakefield-Vette | HEAT SINK PIN FIN 35X35MM CLIP | $4.8 | 50 |